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Solder Paste Measurement
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Inspection
- Advanced Telemetrics International
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Prop Shaft Torque Measurement Systems
Advanced Telemetrics International
ATi Telemetry Systems are typically used to transmit data from rotating shafts or machinery to a stationary receiver. The Miniature Strain Gage Transmitter can be attached to strain gages adhered to your shaft in order to transmit shaft torque and thrust while the system is running.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Printing / Squeegee Force
CmPrint
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern power amplifiers (PAs) and front-end modules (FEMs). Hardware acceleration provides better than 20x speed improvement over Keysight's previous host-based Reference Solution, with closed/open loop digital pre-distortion (DPD) and envelope tracking (ET) measurements taking just tens of milliseconds and overall measurement times less than 70 ms.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Test Pallet
WaveRIDER® NL 2
The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
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Solder Joint Reliability Testing
Solder joint reliability is defined as the ability of your product’s solder joints to function under given conditions and for a specified period of time without exceeding acceptable failure levels.Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits. The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. This provides you with useful technical information for future designs, saving you time and money.
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Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Measurement
Strain Gauge Meter
The program Strain gauge meter is intended for various strain gauge measurements with the use of strain gauge transducers (e.g., force and torque transducers, RPM sensors, bridge and half-bridge circuits based on strain gauges, etc.) and a measurement module for strain gauges ZET 017-T.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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Measurement
Vibration Meter
The input signal of the Vibration meter software, which is the output signal of the accelerometer, i.e. the vibrational acceleration signal, is filtered by means of one of four possible digital band filters. Then, based on this signal, vibrational velocity and displacement signals are calculated by means of integrating filters. Thus, the software generates three signals which are transferred to the ZETLAB data server virtual channels created by the program and having the word “Acceleration”, “Speed” or “Displacement” in their names, respectively.Signals are averaged for a selected time interval (0.1 s, 1 s, or 10 s), after which the obtained values are displayed in the dialog box elements of the Vibration meter program. It is possible to display a root-mean-square (RMS), average amplitude or peak value.
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Measurement
Power Meter
Power Meter is used for determining the power of the electrical current coming to the input channels of ADC modules and FFT spectrum analyzers, or that of the electromagnetic signal.
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68-Pin Micro-D Male Solder Bucket
40-962A-068-SB-M
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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50-Pin D-Type Male Solder without Backshell
92-960-050-M
This connector is designed to allow users to directly terminate cables with soldered connections. 50-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module.
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Solder Cup Connector Kit
Y1140A
Used to build custom cables for 34922, 34924 – 78-pin Dsub female – 60 V
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Measurement Software
Revolutionary, industry-standard, easy-to-use 3D measurement software and CAD modules.
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Ambient Measurement
A measurement of the concentration of a substance or pollutant within the immediate environs of an organism; taken to relate it to the amount of possible exposure.
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Gain-Compression Measurements
S95086B
The S95086B Gain-Compression Measurement (GCA) software provides fast and accurate input power, output power, gain, and phase at the compression point of an amplifier or frequency converter over a specified frequency and power range. With a simple setup, GCA reduces test times through an easy-to-use, fast, and accurate SMART Sweep. GCA also includes a guided calibration that corrects for absolute power levels, frequency response, and mismatch errors.
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
