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- Pickering Interfaces Inc.
product
9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Grypper "Y"
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Grypper G35 / G40
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Ball Pressure Apparatus
BP-20
Is designed to perform tests specified in many standards where resistance of insulating materials to elevated operating temperatures is to be determined. It is used to test insulation materials used in Electrical Appliances, Electrical wiring accessories, luminaires, motors, connectors, etc. The test ensures that external parts of insulating material, the deterioration of which might cause the appliance to fail to comply with the relevant standards, are sufficiently resistant to heat.
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Solder Test Pallet
WaveRIDER® NL 2
The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Ball Pressure Test Device
ZBP-T
Made up by the related item according to IEC60695, IEC884-1, GB/T5169.21-2006, GB4706.1-2005, GB2099.1-2008, etc. • R = 2.5mm Pressure: 20N • Base with thermocouple hole • Material: 304 stainless steel
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Solder Joint Reliability Testing
Solder joint reliability is defined as the ability of your product’s solder joints to function under given conditions and for a specified period of time without exceeding acceptable failure levels.Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits. The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. This provides you with useful technical information for future designs, saving you time and money.
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Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Heavy Load Ball Screw with Caged Ball Structur
HBN
Heavy Load Ball Screw with Caged Ball Structure. Heavy load ball screws with the caged ball structure (HBN model) drastically improve the rated load compared to the conventional products by utilizing the optimum internal structure for use in heavy load condition. In this model, the caged ball structure is adopted between balls to eliminate collisions and mutual frictions of the balls and improve the lubricant maintenance. This modification brings about a longer lifetime under heavy load conditions.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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68-Pin Micro-D Male Solder Bucket
40-962A-068-SB-M
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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50-Pin D-Type Male Solder without Backshell
92-960-050-M
This connector is designed to allow users to directly terminate cables with soldered connections. 50-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module.
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Solder Cup Connector Kit
Y1140A
Used to build custom cables for 34922, 34924 – 78-pin Dsub female – 60 V
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Surface Mount Ball & Socket Test Point
SMOX
SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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Solder Impurity Checker
STA-2
Necessity for on-site lead-free solder management.Applicable for RoHS Directive. (WEEE: Directional on Waste from Electrical and Electronic Equipment, Pb mixed rate under 0.1%) Lead measurement accuracy is +/-150 PPM. Manage increases and decreases of Pb and Cu in your lead-free solder.
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LVDT Displacement Sensors With Ball Swivel Heads
INELTA Sensorsysteme GmbH & Co. KG
This LVDT Series is made for a rough, industrial use. The housing having a diameter of 20mm is fastened "floating" to the application using two ball swivel heads. There is a diversity of displacements up to 200m possible.
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24" Ball Bearing Slides Pair
DRS-24
24"D ball bearing slides ship complete with brackets and all hardware for attachment to cabinet
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Solder Wettability Tester
5200TN
Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Heat-Resistant Test Equipment Ball Pressure Tester
CX-Q002
Shenzhen Chuangxin Instruments Co., Ltd.
Ball Pressure Tester is used for testing parts of non-metallic materials for resistance to heat. It is applicable to electrotechnical equipment, its subassemblies and components, and to solid electrical insulating materials except ceramics.
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IEC60950 50mm Impact Test Balls
CX-15
Shenzhen Chuangxin Instruments Co., Ltd.
The Impact Test Ball is a specially machined ball to test impact resistance according to IEC, CSA and UL Standards. It is made of chrome-plated-steel for durability, and is fitted with an eyelet to facilitate testing for pendulum applications. Eyelet is threaded to the ball to allow attachment of a handle or force gauge. Weights are closely controlled.
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High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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IEC60950 Ball Drop Impact Test Apparatus
Shenzhen Chuangxin Instruments Co., Ltd.
It is mainly used for mechanical strength testing equipment enclosure, test equipment enclosure should be able to ensure that the structure can be expected to withstand the operation does not produce within the provisions of the standard risk for damage to the outer surface of the enclosure will touch dangerous parts of the apparatus.
