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Scanning Electron Microscopy
surface imaging from 1 to 5 nm in size.
See Also: Scanning Electron Microscopes, SEM
- Kreon Technologies
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X-Ray Photoelectron Spectrometer
AXIS Supra
AXIS SupraTM is an X-ray photoelectron spectrometer (XPS) with unrivalled automation and ease of use for materials surface characterisation. The patented AXIS technology ensures high electron collection efficiency in spectroscopy mode and low aberrations at high magnifications in parallel imaging mode. XPS spectroscopy and imaging results can be complemented by additional surface analysis techniques such as: ultraviolet photoemission spectroscopy (UPS); Schottky field emission scanning Auger microscopy (SAM) and secondary electron microscopy (SEM) and ion scattering spectroscopy (ISS). The AXIS Supra replaces the AXIS Ultra DLD as Kratos' flagship x-ray photoelectron spectrometer.
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Contamination Analysis
Contamination Analysis, which begins with a set of basic evaluations that on most occasions will answer the “What is this?” question. The protocol contains four parts:*Visual Examination*Organic Analytical Testing by Fourier Transform Infrared (FTIR) Spectroscopy*Elemental Analytical Testing by Scanning Electron Microscopy / Energy Dispersive X-Ray Spectroscopy (SEM/EDS)*Ionic Analytical Testing by Ion Chromatography (IC)
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Analysis via Scanning Electron Microscopy / Energy Dispersive X-Ray Spectroscopy (SEM/EDS)
The use of Scanning Electron Microscopy / Energy Dispersive X-Ray Spectroscopy (SEM/EDS) in the analysis of failure related issues of printed circuit boards (PCBs), assemblies (PCAs), and electronic components (BGA, capacitors, resistors, inductors, connectors, diodes, oscillators, transformers, IC, etc.) is a well-established and accepted protocol. As opposed to or simply in addition to normal optical microscopy, SEM/EDS allows for the “inspection” of areas of interest in a much more informative way.
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Scanning Electron Microscopy (SEM Analysis)
Rocky Mountain Laboratories, Inc.
Scanning Electron Microscopy (SEM Analysis) can produce images of almost any sample at magnifications of 15-300,000X. The SEM has tremendous depth of field allowing for imaging that cannot be accomplished using optical microscopy. Conductive and nonconductive samples can be imaged. When operated in the backscatter (BSE) detection mode, differences in material composition can be observed. Elemental analysis can be performed on any feature observed with an integrated Energy Dispersive Spectroscopy (EDS) detector.
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Scanning Electron Microscopy
SEM
Materials Evaluation and Engineering
JEOL JSM-6610 LV LaboratoryScanning electron microscopy (SEM) uses electrons for imaging to obtain higher magnifications and greater depth of field than light microscopes. The instruments at MEE are capable of variable-pressure, or low vacuum, SEM (VPSEM), as well as traditional high-vacuum conditions for sample observation. VPSEM is a specialized method using a variable-pressure sample chamber that allows direct evaluation of samples that are not readily examined with a traditional high-vacuum SEM. Nonconductive or vacuum sensitive samples that would typically require additional sample preparation can be directly analyzed in VPSEM without the need for additional sample preparation, such as carbon or metallic conductive coatings. This reduces both sample preparation time and distractions in microanalysis. Our laboratory also has a field emission SEM (FESEM) for critical high-magnification work and low-voltage (LVSEM) applications. Each instrument has a spacious sample chamber that can accommodate large and irregularly-shaped specimens and accessories for feature dimensional analysis and chemical microanalysis.
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TEM Lamella Preparation And Volume Imaging Under Cryogenic Conditions
ZEISS Correlative Cryo Workflow
ZEISS Correlative Cryo Workflow connects widefield, laser scanning, and focused ion beam scanning electron microscopy in a seamless and easy-to-use procedure. The solution provides hardware and software optimized for the needs of correlative cryogenic workflows, from localization of fluorescent macromolecules to high-contrast volume imaging and on-grid lamella thinning for cryo electron tomography.
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Cross Sections and Metallography
Rocky Mountain Laboratories, Inc.
Cross sections are prepared by mounting samples in epoxy and then grinding and polishing the mount for imaging in the optical microscope or Scanning Electron Microscopy (SEM). Valuable information from cross sectioning can include: film thicknesses, inclusions, corrosion thickness, dimensional verification, and subsurface defects. Metallographic cross sections are typically etched to reveal the microstructure. Microstructural analysis can provide information about heat treatment history, corrosion susceptibility, as well as undesirable microconstituents.
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Semiconductor
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Metallurgy Analysis
The metallurgical group is well equipped and staffed (9 full-time metallurgists and technicians) to evaluate materials ranging from cast iron to superalloys to composites. They are experienced in classical metallographic techniques, as well as the latest preparation methods. Advanced analytical tools such as image analysis and scanning electron microscopy (SEM) are used in their evaluations.
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Microscopy
Microscopy is the technical field of using microscopes to view objects and areas of objects that cannot be seen with the naked eye. There are three well-known branches of microscopy: optical, electron, and scanning probe microscopy, along with the emerging field of X-ray microscopy.
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Analytical Services
IGC: Inverse Gas Chromatography; Understand surface energies, polarities, acid/base properties and nanomorphology on powders and fibers. ToF-SIMS: Time-of-Flight Secondary Ion Mass Spectrometry. Localize your molecules at the first nanos! 2D imaging with resolution up to 200 nm. Highest sensitivity up to 10 ppm. CM: Quarz Crystal Microbalance In-situ observation of thickness and stiffness of any films in liquid environmentSEM: Scanning Electron Microscopy Images say more than words, especially with an artistic eye XPS/ESCA: X-ray Photoelectron Spectroscopy/Electron Spectroscopy for Chemical Analysis.
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Cathodoluminescence Solutions for Electron Microscopy
CLUE Series
HORIBA Scientific's Cathodoluminescence Universal Extension enhances any SEM’s analytical capabilities while maintaining its original functionality. Since the sample is able to remain in the same spot, CLUE can easily be combined with other microscopy applications, such as EDS and EBIC.
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Scanning Electron Microscopes
Our Scanning Electron Microscopes (SEMs) resolve features from the optical regime down to the sub-nanometer length scale.
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Scanning Electron Microscope
SEM
Delivers the world's best resolution with the incorporation of the newly-developed, super-high resolution Gentle Beam (GBSH). In addition, the maximum probe current of the In-lens Schottky Plus gun has been increased from 200 nA to 500 nA.
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Electron Sources
SPECS Surface Nano Analysis GmbH
To our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.Compliance with industry standards, a good price-performance ratio, stability, and longevity are the guidelines for our product development. We focus on standardized easy handling, user-friendliness, standardized software interfaces and safety.
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X-ray Microscopy
ZEISS Xradia Versa
Extremely versatile ZEISS Xradia Versa 3D X-ray microscopes (XRM) provide superior 3D image quality and data for a wide range of materials and working environments. Xradia Versa XRM feature dual-stage magnification based on synchrotron-caliber optics and revolutionary RaaD™ (Resolution at a Distance) technology for high resolution even at large working distances, a vast improvement over traditional micro-computed tomography. Non-destructive imaging preserves and extends the use of your valuable sample, enabling 4D and in situ studies.
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Electron Probe Microanalyzer
EPMA-8050G
This instrument is equipped with a cutting-edge FE electron optical system, which provides unprecedented spatial resolution under all beam current conditions, from SEM observation conditions up to 1 μA order. Integration with high performance X-ray spectrometers that Shimadzu has fostered through the company's traditions achieves the ultimate advance in analysis performance.
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X-ray Microscopy
Xradia Family
✔ Characterize the properties and behaviors of your materials non-destructively.✔ Reveal details of microstructures in three dimensions (3D).✔ Develop and confirm models or visualize structural details.✔ Achieve high contrast and submicron resolution imaging even for relatively large samples.
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Scanning Probe Microscopy/Atomic Force Microscopy (SPM/AFM Analysis)
Rocky Mountain Laboratories, Inc.
Scanning probe microscopy (SPM) refers to a family of measurement techniques that utilize a scanning probe. The most common measurement is Atomic Force Microscopy (AFM Analysis), which measures surface topography. Imaged areas can be from the nm scale to as large as 100 µm X 100 µm. Heights and depths of features can be measuredand many surface roughness parameters, e.g Ra, can be calculated. 3-D images can also be produced for dramatic data presentation. Magnetic and electrical response can also be measured with SPM.
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Laser Scanning
Laser scanning is the non-contact alternative to tactile probing, which along with point cloud processing software, enables an entirely digital inspection process. From measurement preparation to final report, this approach is significantly faster, provides a more profound insight and lowers development costs.
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Scanning Probe Microscopy
SPECS Surface Nano Analysis GmbH
As Scanning Probe Microscopy (SPM) is a key tool for nanotechnology, SPECS offers dedicated solutions for highly demanding requirements.In UHV, strong emphasis lies on spectroscopic methods such as scanning tunneling spectroscopy and inelastic tunneling spectroscopy as well as single atom and molecule manipulation. With the invention of a Joule-Thomson cryostat by Prof. Wulf Wulfhekel, SPECS now offers the JT-STM , operating sample and sensors in thermal equilibrium below 1K with optional high magnetic field.
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Scanning Electron Microscopes
SEM
Scanning Electron Microscopes (SEM) scan a sample with a focused electron beam and obtain images with information about the samples’ topography and composition.
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Electron Microscope Analyzer
QUANTAX Micro-XRF
Micro-X-ray Fluorescence (Micro- XRF) spectroscopy analysis is a complementary non-destructive analytical technique to traditional Energy Dispersive Spectroscopy (EDS) analysis using a Scanning Electron Microscope (SEM).
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Microscopy and Automation Solutions
Opto already offers automated multifluorescence microscopes for cell analysis, inverted autofocus microscopes for motion analysis of growth processes, and high- throughput fluorescence microscopes for DNA and RNA sequencing.
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Scanning Kelvin Probe
Our large range of Scanning Kelvin Probes gives the user full access to 2D and 3D work function plots of samples ranging in size from 50 mm to 350 mm. With work function resolution of 1 - 3 meV, and the spatial resolution of the Probe tip diameter (0.05 mm with the SKP5050 model), the Scanning Kelvin Probe gives reliable, repeatable measurements for work function, contact potential difference and Volta potential.
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Scanning Electro-chemical Microscope
920D
The scanning electrochemical microscope (SECM) was introduced in 19891 as an instrument that could examine chemistry at high resolution near interfaces. By detecting reactions that occur at a small electrode (the tip) as it is scanned in close proximity to a surface, the SECM can be employed to obtain chemical reactivity images of surfaces and quantitative measurements of reaction rates.
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3D Scanning Software
Software is a comprehensive component to any advanced metrology system. Combined with laptops and portable equipment, 3D scanning and measurement is now possible virtually anywhere. 3D scanner software plays a critical role in every stage from the creation of a concept design to the manufacturing and inspection of prototypes. Below is a look at some of the Laser Scanner Software and 3D Scanner Software providers and platforms we represent and handle.
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Laser Scanning Microscope
OLS4100
The LEXT OLS4100 is a Laser Scanning Microscope to perform non-contact 3D observations and measurements of surface features at 10 nanometer resolutions. It also features a fast image acquisition and a high-resolution image over a wider area.
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Electron Microscope Analyzer
QUANTAX EBSD
QUANTAX EBSD system, with its popular OPTIMUS 2 detector head, is the best available solution for analyzing nanomaterials in the SEM
