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IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
- TEAM SOLUTIONS, INC.
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DC-to-60MHz 1:10 Oscilloscope Probe Kit (HP-9060 Or HP-3060)
PRB-HP-9060
Up to 60MHz, Includes a handy storage pouch and includes an IC test-hook adapter for the probe., The BNC connector rotates to avoid cable tangle or kink., Cable length is 1.4 meters.
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Micro probes 1 MHz up to 1 GHz
MFA 02 set
The two in the set included micro probes are used to measure low-frequency magnetic fields up to 1 GHz, e.g. at signal conductors (150µm), SMD componets (0603-0201) or IC pins. The MFA micro probes are guided by hand. An amplifier stage is integrated into the probe head. The amplifier stage (9V, 100mA) is powered via the BT 706 Bias tee. It has an impedance of 50 Ohm. The micro probes are connected via the Bias tee to a spectrum analyzer or an oscilloscope. The MFA 02 set delivery of Langer EMV-Technik GmbH includes correction lines. With the help of the correction lines the probe output voltage is converted either into the respective magnetic field or to the current which is running through the conductor.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Low Cost Microwave Wideband PIN Preamp Receivers
MR21 (40KHz~18GHz)
Hangzhou Huatai Optic Tech. Co., Ltd.
MR21 series microwave wideband optical receiver, adopts High linear PIN diode and Low noise pre-amplifier IC, within bandwidth of 40KHz~18GHz, they are featured with excellent linearity, high responsibility and superior flatness of the RF response in both, power and phase. They provide an outstanding linearity fiber optical communication for analogue wideband microwave application. Due to avoidance of using expensive coaxial cable or wave guide, there will be no limitation in transmission distance, which improves the signal quality and reliability of the microwave communication. They can be widely applied in microwave communication system such as remote wireless, timing and reference signal distribution, telemetry, measurement and delay line etc as well as 10Gb/s and 18Gb/s high speed communication system.
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784965-01
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Surface Mount Package Emulation
SMT Adapters
Ironwood’s SMT package emulation adapters are often called “surface mount feet” or “emulator bases”. These adapters provide access and interconnections to surface mount lands. Typically, the adapters are soldered to the target board in place of the IC device and provide a pluggable array of pins interface for sockets, probing adapters, package converters, and even board-to-board connections. These adapters are often utilized as a base for many of our probing adapter products. We constantly innovate to provide the most reliable, cost effective interfaces available. For example, many of our PLCC, QFP and SOIC emulation bases use our proprietary shaped solder techniques, replacing expensive, and often fragile, J-lead and Gull Wing leads. Shaped solder parts are easily fluxed and reflowed onto the target system. Our emulator bases can present either a male or female interface at 1.27mm or 1mm or 0.8mm pitch gold plated array pins for pluggable connection.
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MPI Sorter Series
MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Analog IC test system
A paradigm shift has been occurred in Japan’s major brand WL25 series tester. Ultimate simple system is available by effective analog pin architecture.This cost performance system is covered analog IC extensively, which are high accuracy, speed and multi-site test function.
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6U VPX PCIe to XMC Expansion Board
VP69601
LinkedHope Intelligent Technologies Co.,Ltd.
VP69601 is a 6U VPX PCIe to XMC expansion board. Onboard there is a x8 PCIe 3.0 interface, and through a PCIe connector the x8 PCIe 3.0 turns into 2 x8 PCIe 3.0 linking to 2 XMC cards. The PCIe Switch IC on VP69601 supports DMA, so direct data transmission between peripheral cards can be realized.VP69601 can be installed in a standard VPX chassis and work as a peripheral board. VP69601 carries two XMC ports, through which users can expand various functional XMC cards needed.Apart from the traditional Air Cooling design, Linkedhope○R provides a Conduction Cooling version to guarantee working stability of VP69601 in extreme and vibration environment and in an extended working temperature from -40℃ to +70℃.
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Laser Induced Incandescence (LII)
Soot is considered a hazardous pollutant emission and is typically a result of incomplete combustion processes, and thus is also related to combustion performance. Laser Induced Incandescence (LII) is a laser-optical measurement technique dedicated to soot diagnostics. LII can provide measurements of soot volume fraction, such as in Diesel engine exhaust, and even instantaneous images of soot distribution during formation inside a running IC engine.
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Shunt Regulators
These are the standard reference voltage source widely used by the feedback circuits of switching power supplies. Compared to the Zener diode, which is a discrete product, a shunt regulator has much better voltage precision because voltage control is carried out as an IC.
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Digital Interface Boards
Model 4863 OEM
* 114514 Board has same digital capability as the 4863 described above with GPIB IO.* GPIB interface header includes GPIB address switch input signals.* Use with any IC GPIB Connector/Address Switch Assembly.* Uses 9-32 Vdc power.* 114515 Board has same digital capability as the 4863 described above with GPIB and Serial IO.* GPIB interface header includes GPIB address switch input signals.* Serial interface header includes RS-232 and RS-485 signals. Use the 114597 Serial Cable Kit to connect the serial signals to your rear panel* Use with any IC GPIB Connector/Address Switch Assembly or with a 114597 Serial Connector Kit.* Uses 9-32 Vdc power.
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Low Noise Test Leads For N1413 With B2980 Series, 3m
N1425B
The N1425B is designed to operate specifically with the B2985B/87B. It can hold DUTs with large terminals being used with the N1426C. The N1426A with the N1425B is available for measurements of small DUTs such as PC boards or IC sockets. The N1426B with the N1425B enables the construction of simple custom-made test leads. The N1413A High Resistance Meter Fixture Adapter is also required to connect the N1425B to the B2985B/87B.
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Near Field Probes
MFA Family
The micro probes allow detailed measurements of high-frequency magnetic fields in the layout, at the smallest SMD components(0603-0201) and at IC pins of printed circuit boards.
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Water Meters
Shenzhen Star Instrument Co., Ltd.
IC cold/hot water meter manages perches and consumption by using a contact IC card as data medium.
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Electrical & Electronic Simulation
Maya Heat Transfer Technologies Ltd.
Improve the design of electrical and wire harnesses, electronic systems, and integrated circuits (IC). Find software solutions to facilitate the development of electrical systems for large, complex platforms.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Reticle Manufacturing
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Quad Flat Pack IC Clip Pair (Yellow/Green) (Qty.1 Pair)
PK-ZS-025
Quad Flat Pack IC Clip Pair (Yellow/Green) (Qty.1 Pair)
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Dual PCM Tester
MS-177
This equipment is used for PCM function test to check thestate ofsingle IC PCM as well as dual IC PCM. It is applied for only 1Cell PCM and can consist ofup to 40 Channels.
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Scatterometer with Thin Film Measurement Capabilities
OptiPrime-X Series
The n&k OptiPrime-X series are automated metrology systems used to fully characterize and monitor Thin Film and OCD applications for both current and next generation IC processes.
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Isolation Amplifier Digital Output
This coupler is an optically coupled isolation amplifier that uses an IC with a high-accuracy sigma-delta A/D converter and a GaAIAs light-emitting diode with high-speed response and high luminance efficiency on the input side, and an IC with a digital signal (MDAT, MCLK) output function on the output side. This coupler is designed specifically for high common mode transient immunity (CMTI) and high linearity (nonlinearity) applications, making it ideal for current sensing in motor drives.
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Circbord
8003
VECTOR Electronics and Technology, Inc.
Pad per hole & peripheral ground plane.0.085” Square pads etched around each hole on wiring side.Accommodates any type DIP IC device or discrete component.Single sided board with pads and peripheral GND plane on one side only.Single-sided with no etch and plating on reverse side.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Isolation Amplifier Analog Output
This coupler is an optically coupled isolation amplifier that uses an IC with a high-accuracy sigma-delta A/D converter and a GaAIAs light-emitting diode with high-speed response and high luminance efficiency on the input side, and an IC with a high-accuracy D/A converter on the output side. This coupler is designed specifically for high common mode transient immunity (CMTI) and high linearity (nonlinearity) applications, making it ideal for current sensing in motor drives.
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Emulation & Test Interface
Solder down modules to suit any package type provides a cost effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
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Near Field Probes 1GHz - 10 GHz
SX set
The SX1 set consists of 3 passive near field probes for making measurements in the development phase of E-field and magnetic field with a high clock frequency in the range from 1 GHz to 10 GHz. The probe heads of the set SX allow for measurements close to electronic assemblies, e.g. on single IC pins, conducting paths, components and their connectors, to localize interference sources. Field orientation and field distribution on an electronic assembly can be detected through trained use of the near field probe. The near field probes are small and handy. They have a sheath current attenuation and are electrically shielded. They can be connected to a spectrum analyzer or an oscilloscope with a 50 Ω input. They have an internal terminating resistance.
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Wireless Test Solutions
Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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Breakthrough compressors for the GDSII and MEBES formats
GDZip + MEZip
Recognizing the challenge to transfer, manipulate, and store the exponentially-increasing size of IC design files, Solution-Soft has developed gdzip and mezip, breakthrough compressors for the GDSII and MEBES formats used by the industry. The MEBES format is the most commonly used format for electron beam lithography and photomask production. The GDSII stream is the standard exchange format between the design world and the mask shops.
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Power IP
An IC development is never a reproduction of a previous IC, however there is no need to invent the wheel twice.Considering our extensive IC design experience in the domain of power control we will likely find existing IP blocks to speed up a new IC development. We gladly evaluate if and how our IP can be succesfully reused or applied in your next IC development, and focus on achieving your essential IC requirements in a shorter development time.Our experience includes the following elements which have been developed in a diversity of technologies, from standard CMOS process (mostly 180nm) to 350nm 700V CMOS.
