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BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
- Taylor Dynamometer, Inc.
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Versatile, Heavy-duty Hydraulic Test Centers
HTC Series
For powertrain testing it’s all about fast and exceptional results achieved in the safest manner possible. Our Hydraulic test stands HTCs offer full functionality to test all types of transmissions, motors, cylinders, valve blocks, torque converters and pumps. As you evaluate your needs for heavy-duty mobile testing equipment, consider how upgrading to the latest technology can improve your bottom line.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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EFT Module for Teststand
The Electronics Functional Test (EFT) Module for TestStand provides out-of-the-box tools to speed up development of automated tests for electronic assemblies including PCBAs, subassemblies and final assemblies. Test engineers can develop, deploy and execute test sequences quickly and efficiently with minimal custom code development for a shorter time-to-solution.
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Military Communications Test
Astronics testers for military radios and wireless communications systems help you keep your most critical communications up and running smoothly. Write test program sets once and deploy them instantaneously everywhere – whether your test set is in the factory, at the depot, or in operation.
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Prototyping & Test Consulting Services Solutions
Don’t cut corners on the path to quality. We are experts in Design for Test (DFT), Design for Manufacturing (DFM), agile development, prototyping and standards/best practices in many industries. Speak to our prototyping and consulting services experts to ensure you make the right decisions and investments at the start of your project.
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FPD Tester Model
27014
Chroma 27014 Flat Panel Display Tester is a complete testing solution that meets the Liquid Crystal Module testing requirements of production line. With integrated video generator, multi-channel precision power supply and process control unit, the system allows a complete test of signal, pattern and electrical parameters of LCM through a PC or remote control box.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Test System Replication/Build-to-Print
Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
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ARINC 818 Tester
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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PCIe 5.0 Test Platform
PXP-500A
The Teledyne LeCroy PXP-500A Test Platform provides a convenient means for testing PCIe 5.0 cards with a self-contained portable and powered passive backplane. The PXP-500A provides power required for both cards under test.
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Regenerative Battery Pack Test System
17040E
High-power testing equipment up to 1,700V/ 4800A/ 1.2MW Multiple safety protections for personnel safety risk management and control of battery testing Flexible Integration for automated battery verification solutions
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Functional Test Fixtures
Reliable connections to device under test (DUT) test points are essential for robust functional test. Bloomy provides rugged fixtures and cable sets (ITAs) built for thousands and thousands of cycles in manufacturing environments. With the industry’s best mass interconnects and internal electronic keying, our fixtures are easy to change out and are automatically recognized by the test system.
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Universal In-Line Test Platform
UniLine brings 20+ years of test & quality experience to your manufacturing floor and test automation delivers accurate results, without bias. By standardizing test, product quality improves as costs decrease. Equipment becomes understandable and manageable across departments and station support becomes simple.
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Benchtop Communication Test System
ATS3000A
The ATS3000A is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23 instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000A also includes the sophisticated IF and baseband I/Q Digital Signal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easy-touse graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets areavailable for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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Iridium Physical Layer Test Systems
PLTS
Averna has worked with Iridium to ensure you have the right equipment to support their test coverage. The Iridium PLTS verifies product performance to Iridium’s standards. Find out more!
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In-Circuit Tester
Sparrow MTS 30
The Sparrow MTS 30 is a 19“ test system that can be integrated into any standard rack. The In-Circuit tester can also be used as benchtop test system. With this compact and flexible tester you can perform both analog and digital In-Circuit and functional tests.
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In-Circuit Test System Calibrations
Regular calibration is essential to ensure accuracy and reliability in testing. Forwessun offers precise calibration services tailored to your test systems, verifying that all components meet industry standards. Our calibration services maintain peak accuracy and compliance, so you can be confident in your system’s performance for any testing application. Choose from one-off calibrations or scheduled service contracts to meet your needs.- HP3070 - Agilent- Keysight - GenRad- Teradyne
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Electronics Functional Test
Functional test for productive manufacturing. Manufacturers of products enabled by electronics must assure proper operation prior to shipment. Bloomy’s line of universal test systems are ideal for functional test of your PCBAs and subassemblies, from the simplest to the most complex. The UTS family of products combines high-performance test instruments, switching, power control and mass-interconnect hardware with our robust UTS software suite into a low-risk, cost-effective and powerful test solution for your device under test (DUT).
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Test Products & Platforms
Save yourself months of work on test specifications, component ordering, assembly and trial-and-error operation.
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Battery Management (BMS) Environmental Test System
The BMS Environmental Test System is a configurable platform simulating the essential signals used by Battery Management Systems (BMS) and cell-monitoring modules with the ability to perform environmental testing on multiple BMS units simultaneously. The system implements single-point value testing to evaluate specific BMS functions such as cell over and under voltage scenarios, cell leakage current, lost communications, or faulty system IO.
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Communications Test System for Frontline Diagnostics
CTS-2750
The CTS-2750 is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The field-upgradeable, software-defined architecture features easy-to-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets can be created easily using the included TestEZ® software suite.
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EV Power Components End of Line Test Platform
Test and Validate all EV Power Electronics with One Flexible and Scalable Solution
