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Lithography
nano fabrication of circuitry.
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Lithography System
JetStep G35
The Jetstep G35 system is a high volume manufacturing imaging system for up to Gen 3.5 displays.The JetStep G35 system enables high resolution imaging down to 1.5µm combined with registration and stitching accuracy required by most advanced manufacturing of high resolution displays.
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Lithography System
JetStep W2300
The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge.
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Nanopositioning Systems
Mad City Labs'' nanopositioning systems move and maintain the position of objects with sub-nanometer precision and high stability. Applications for nanopositioners include super resolution microscopy, high speed confocal imaging, AFM, NSOM, SPM, optical trapping, fiber positioning, single molecule spectroscopy, single molecule/particle tracking, high resolution optical alignment, nanoscopy and lithography.
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Laser Head
5517GL
The Keysight 5517GL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Electron Beam Lithography System
Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
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Lithography System
JetStep X500
The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
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Laser Interferometers
ZYGO laser interferometers support and enable the most demanding metrology applications in industries from semiconductor and lithography to space-borne imaging systems, cutting-edge consumer electronics, defense-related IR and thermal imaging systems and ophthalmics.
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CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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EUV Lithography
EXE systems
EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8 nm.
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Laser Heads
The laser head is the source of the laser beam used in all laser motion and position measurement systems. The primary difference between laser heads is in the velocity, reference frequency and optical output power. Other considerations are size, heat dissipation, and input power requirements. Which laser you choose depends primarily on the application in which it will be used. For example, semiconductor lithography systems typically have faster moving parts (stages), and therefore need higher velocities than machine tool applications.
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Desktop Maskless Lithography
Desktop Size Maskeless (direct-exposure) Lithography System which supports simple lithography operation by its sophisticated software.
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Dry Systems
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Breakthrough compressors for the GDSII and MEBES formats
GDZip + MEZip
Recognizing the challenge to transfer, manipulate, and store the exponentially-increasing size of IC design files, Solution-Soft has developed gdzip and mezip, breakthrough compressors for the GDSII and MEBES formats used by the industry. The MEBES format is the most commonly used format for electron beam lithography and photomask production. The GDSII stream is the standard exchange format between the design world and the mask shops.
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Inspection Systems
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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Refurbished Systems
Refurbishing ‘classic’ PAS 5500 and TWINSCAN lithography systems for a new life and a new purpose
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Computational Lithography
ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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Laser Head
5517CL
The Keysight 5517CL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Option 009 allows a larger angular range of measurement by providing a 9 mm beam diameter for use with three-axis interferometers. Please contact Keysight for custom requirements.
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EUV Lithography Systems
Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible
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IDA Electrodes
Interdigitated Array (IDA) electrode is an electrode developed for electrochemical measurements to be performed in a very small quantity of the sample. IDA electrode could be applied for the detection and reaction analysis of the compounds in a small quantity of the sample. IDA electrode is a microelectrode pattern fabricated by using the lithography technology. The Electrodes are composed of 65 pairs. In each one of the pair has a function of the oxidation and reduction electrodes.
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Laser Head
5517D
The Keysight 5517D is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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DUV Lithography Systems
ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
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Laser Head
5517C
The Keysight 5517C is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Option 009 allows a larger angular range of measurement by providing a 9 mm beam diameter for use with three-axis interferometers. Please contact Keysight for custom requirements.
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Laser Head
5517EL
The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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Semiconductor Manufacturing Optics
No lithography without optics. No semiconductors without lithography. Without semiconductors there would be no microchips, without microchips no computers – no high-tech products. As an OEM (Original Equipment Manufacturer) supplier, ZEISS enables the semiconductor industry worldwide with optics and other optical modules.
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Automated Measurement System
EVG®40NT
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
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Reticle/Mask Particle Remover
RP-1
The RP-1 automatically removes particles from the reticle/mask by air (or N2) and vacuum suction. Routinely removing the particles before the lithography process extends the replacement cycle of the pellicle and cleaning cycle of the mask, thereby contributing to a reduction in running costs.
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Laser Head
5517DL
The Keysight 5517DL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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2-26.5 GHz Traveling Wave Amplifier
1GG7-8045
The 1GG7-8045 is a broadband GaAs MMIC Traveling Wave Amplifier designed for high output power and moderate gain over the full 2 to 26.5 GHz frequency range. Seven MESFET cascode stages provide a flat gain response, making the 1GG7-8045 an ideal wideband power block. Ebeam lithography is used to produce gate lengths of ~0.3 mm. The 1GG7-8045 incorporates advanced MBE technology, TiPtAu gate metallization, silicon nitride passivation, and polyimide for scratch protection.
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Interference Lithography Gratings
Interference lithography is an optical nanolithography technology for the fabrication of extensive periodic nanostructures. Critical dimensions of less than 50 nm can be realized. At AMO two interference lithography tools are installed. One setup for extensive, high quality gratings with fixed periods, the other more flexible tool allows quick prototyping. We offer grating fabrication on silicon, silicon dioxide and other substrates with tailored pitch, etch depth and size.
