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Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
- Virginia Panel Corporation
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Tool, Inspection Depth Gauge, Mini Coax, Receiver
910121156
Used to verify the depth setting of the center conductor of receiver mini coax contacts.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Flexible Test And Scan Solution For FFC Devices
Ismeca NY32W
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Grain Inspector
iS-G1
The iS-G1 is a full line speed optical module for the inspection of crystal grains.Using our new grain imaging technology, the iS-G1 is able to inspect as cut wafers at full inline speed with no need to stop the conveyor belt. Automated algorithms analyze the grains and report metrics.
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ECHO VS System with Image Enhancement
Echo VS
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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IR Inspection System
EVG®20
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Benchtop Discrete Component Tester
Imapact 7BT
The 7BT Benchtop Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The 7BT automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Particle Deposition Systems
MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Process Particles Suspensions
Process Particles™ Suspensions are used as particle material standards. They represent real-world contaminant particles encountered in semiconductor device fabrication processing. Deposition of these particles on wafers and reticles enables characterization of the material-dependent response of a surface inspection system when accurate particle size or particle sphericity are of secondary importance. They consist of broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW). Each bottle contains a suspension volume of 100 mL.
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NUV-PL SiC Defect Inspection System
VS6845E
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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System to Handle Wafer Levels
AMI AW Series
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Image Sensor/Fingerprint-on-Display Testing
Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Machine Vision Computers
AIIS Series
Advantech AIIS Series are closely aligned with Machine Automation applications such as Automated Optical Inspection (AOI), Wafer Inspection, and alignment inspection which heavily rely on machine vision.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Semiconductor & Flat Panel Display Inspection Microscopes
MX63 / MX63L
The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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The Lorlin© Impact Series
Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability. The system tests most all discrete semiconductors with reliable, accurate, and repeatable results.
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Inspection Systems
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Automated Metrology System
EVG®50
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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microLED Testing System
OmniPix-ML1000
The OmniPix-ML1000 is the first all-encompassing microLED testing system, offering both full wafer and localized individual pixel inspection. Measure localized and total EQE. Use automated PL and EL to test and characterize your microLEDs. Analyze defective pixels with nano-PL and nano-EL.
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Nano-focus X-ray Inspection System
X-eye NF120
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Semi-automatic Measuring And Alignment System
McBain Z-NIR Near Infrared Inspection Microscope
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Front-end
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
