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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
- TEAM SOLUTIONS, INC.
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GPIB PC/104 Interface Card & Cable
GPIB-PC104-XL
The ines GPIB PC/104 interface card uses the enhanced features of the ines GPIB chip , resulting in a reliable solution for industrial measurement.
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Extreme Rugged PC/104-Plus, PCI-104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM3-BT4
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Thyristors Application Specific Devices
A.S.D. (Application Specific Discretes) technology is a vertical integrated power technology using a full planar process. By applying the masking process on both sides of the chip, higher current density is achievable than is possible with epitaxial base or horizontal structures.
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MPI Sorter Series
MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Fourier Transform Optical Spectrum Analyzer, 600 - 1700 nm
OSA202C
Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines. Many commonly available OSAs use grating-based monochromators, which have slow acquisition times due to the need to mechanically scan the grating and average out noise at each wavelength. Thorlabs' OSAs acquire the spectrum via a Fourier transform using a scanning Michelson interferometer in a push/pull configuration. This approach dramatically improves the acquisition time, enables a high-precision wavelength meter mode with 7 significant figures and ±1 part-per-million accuracy, and allows the included software to provide robust statistical analysis of the acquired spectra, as explained in the Design tab.
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Attenuators
The 01311 attenuator chip series is designed to achieve precision and tight flatness with an attenuation accuracy of ± 0.2 dB on our 1-10 dB pads and ± 0.3 dB on our 11-20 dB pads. SemiGen tests 100% of all attenuator chips prior to shipment to verify that they meet specifications.
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Narrow band & Linear SSPA
Exodus Advanced Communications
Exodus Narrowband CW and Linearized SSPA products feature LDMOS, GaN,GaAsFET discrete and Chip & Wire Hybrid technologies covering frequency ranges from 1MHz to 26.5GHz at power levels exceeding 1KW for Modules and 10KW for Systems
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.13u ESD diode
Impulse TSMC
The Impulse TSMC .13u ESD diode was made to provide ESD discharge paths when integrating third party IP in an integrated circuit design for total ESD protection. The Impulse ESD diode has been successfully used with Dolphin Technologies, Artisan/ARM, TriCN/Synopsis I/O libraries, as well as popular IP blocks from RAMBUS, Chip Idea and other quality IP vendors. A 5.5 volt reverse bias anode to cathode operational specification enables the Impulse TSMC .13u ESD diode to be the device of choice for 5 volt tolerant designs.
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In-chip Monitoring Solutions
Range of in-chip monitoring and embedded sensing fabrics allows for meaningful data to be captured at each stage of a chip’s lifecycle. Manufacture | Wafer Sort | Package Test | In-field | End-of-lifeDeep in-chip sensing, telemetry & analytics enablement. Highly distributed, real-time thermal analysis. Supply voltage sensing for power optimisation. Chip assessment for chip to product appropriation.
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Low Light USB Camera With Microphone
Conversa
Conversa, camera for conversation (See3CAM_CU38), is a 3.4 MP low light USB 3.1 Gen1 camera with built-in stereo microphone providing 16bit audio @48KHz. This low-light USB camera is the next advanced version of our flagship product See3CAM_CU30, with built-in stereo microphone for crystal clear sound. It is a plug-and-play (UVC and UAC) compliant USB 3.1 Gen1 SuperSpeed camera and is also backward compatible with USB 2.0 host ports. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control).
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Converter
Converter and driver chips ensures data rates above 1 MBaud and therefor reliable data transmission also with highest rates.
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Digital Mission Engineering
From chip to mission, connect modeling and simulation efforts across all phases of the engineering product life cycle. Model multi-domain operational environments, including land, sea, air and space, with accurate, dynamic, physics-based simulations. Integrate with the Ansys portfolio of multi-physics tools and solvers to achieve unmatched end-to-end modeling and simulation.
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Helium Analyzer
DTX832-He
The Neutronics DTX832-He Helium in Air Analyzer is for helium in air measurement. With an Ethernet digital communication interface along with 4 to 20 mA output, this analyzer combines ease of use with simple installation, configuration, and integration into DCS and PLC control systems. Used with a well-proven thermal sensor technology that combines the sensor element, signal processing and digital calibration on one small chip, this helium analyzer is an ideal choice for demanding and cost sensitive process control applications.
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BSDL File Validation
Corelis offers services to validate the accuracy of Boundary-Scan Description Language (BSDL) files that characterize the boundary-scan functionality of semiconductor devices. These services include validation of a device's BSDL file while the chip is still in development and BSDL file accuracy verification against actual silicon.
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SparkFun GPS Breakout
NEO-M9N, Chip Antenna (Qwiic)
The SparkFun NEO-M9N GPS Breakout with on-board chip antenna is a high quality GPS board with equally impressive configuration options. The NEO-M9N module is a 92-channel u-blox M9 engine GNSS receiver, meaning it can receive signals from the GPS, GLONASS, Galileo, and BeiDou constellations witn ~1.5 meter accuracy. This breakout supports concurrent reception of four GNSS. This maximizes position accuracy in challenging conditions, increasing precision and decreases lock time; and thanks to the onboard rechargeable battery, you'll have backup power enabling the GPS to get a hot lock within seconds! Additionally, this u-blox receiver supports I2C (u-blox calls this Display Data Channel) which made it perfect for the Qwiic compatibility so we don't have to use up our precious UART ports. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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Metal Glazed High Voltage Chip Resistors, Anti-Sulfuration
SMG Series
*Flameproof UL94VO molded package, resistance to sulfuration, heat and humidity.*Special design for automatic surface mounting.*Metal-glaze elements provide high stable performance against environmental conditions and overload.Excellent mechanical strength & electrical stability.*Reducing assembly costs.
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Low Resistance Metal Film Chip Resistor
RTX
This specification is applicable to lead and halogen free RTX series low resistance metal film chip resistors. Lead free products mean lead free termination meets RoHS requirement.
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FPGA Boards
For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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Mass Flow Controllers for Gases
Sensirion''s mass flow controllers are characterized by fast and accurate control of gas flow over a wide dynamic range. Based on the innovative CMOSens Technology, the heart of these mass flow controllers is a calorimetric microsensor (MEMS), which is integrated with the complete signal conditioning electronics on one single chip. While the flow is measured using the thermal measurement principle, efficient control is provided by an analog controlling circuit. This unique integrated technological approach results in excellent performance and reliability - at a very attractive cost.
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Pyroelectric Detectors
Pyroelectric detectors are thermal detectors; i.e. they create an electric signal due to temperature changes in the chip. This temperature change is caused by absorption of light. We do use LiTaO3 and DLaTGS as pyroelectric materials. Basically such detectors cover the whole spectra. However, they are mainly used for mid-wave and long-wave infrared detection (MWIR and LWIR). In addition, the usage in the THz region seems to become more popular these days.
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Tantalum-Polymer
POSCAP™
Panasonic Industrial Devices Sales Company of America
Panasonic POSCAP™ Solid Electrolyte Chip Capacitors offer stable capacitance at high frequency and temperature, with low-ESR/ESL. These Capacitors utilize a sintered tantalum anode with a proprietary high-conductivity polymer cathode. Panasonic's innovative construction and processing yields one of the lowest ESR levels in Tantalum-Polymer Capacitor technology, while exhibiting excellent performance in high frequency applications. POSCAP Capacitors are available in various, compact package sizes for a small PCB footprint while offering high volumetric efficiency for capacitance. In addition, Panasonic’s POSCAP parts demonstrate high reliability and high heat resistance, making them the ideal Chip Capacitor for digital, high-frequency devices and more.
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Signal Integrity Products
Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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mmWave Sensors
The world’s most precise millimeter wave sensor available today on a single chip. The world’s most precise millimeter wave sensor available today on a single chip. TI’s CMOS single-chip sensors integrate an RF front-end with a DSP and MCU.
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Goniophotometers
Goniometer has the capability not to only fit into almost every optical laboratory, but also to provide measurement data on concise level. The type C set up of this instrument enables the developer of single LEDs, LED modules or chips to study angular performance in many development stages; fast and most important: reliable. The detector head of the goniometer is a high-quality, visible-range spectrometer, equipped with diffuser optics to collect all important measurement quantities over the customer required angular range. With a maximum allowable source sample size of 300mmx100mm and 25kg, the new benchtop goniometer covers a wide range of LED measurement requirements. The footprint of the instrument itself with 1.65mx0.60mx1.73m allows the usage also in small dark rooms and optical laboratories.
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ISDN Chip Set
Emutel Symphony
Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Chip Test Adapter
SOJ EDO/FPM
Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Clock Generation Devices
Analog Devices offers ultralow jitter clock generation products for wireless infrastructure, instrumentation, broadband, automatic test equipment, and other applications demanding subpicosecond performance. Our clock products are ideal for generating the high speed, low noise clock signals required to clock high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Ground Leads Continuity Tester
Weshine Electric Manufacturing Co., Ltd
1. The new power supply technology is adopted in the grounding down lead conduction tester.2. It has the characteristics of small size, light weight, large output current, good repeatability, strong anti-interference ability and protection function. 3. The whole machine is controlled by single chip microcomputer, which has a high degree of automation. 4. The instrument has high precision and easy operation. The maximum current is 10A.
