Teradyne, Inc.
Teradyne tests and helps build the world’s most innovative products. Our leading-edge testers make sure that new products work right the first time, every time. And our robotics portfolio helps manufacturers to develop and deliver new products quickly, efficiently and cost-effectively.
- +1 800-837-2396
978 370-2700 - 978 370-1100
- customercare@teradyne.com
- 600 Riverpark Drive
North Reading, MA 01864
United States of America
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Automotive Test Platform
ETS-800
Next-Gen Automotive Test Platform With the Industry’s Highest Throughput and Fastest Time to Market
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Test Points
TestStation LX2
TestStation LX2 is Teradyne's largest pin count in-circuit test system. Configurable up to 15,360 pins, TestStation LX2 utilizes the new UltraPin II 128HD pin card for testing large, complex, and heavily-integrated printed circuit board assemblies.
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5G Testing
Teradyne test solutions are at the forefront of the 5G test era. Why? We work with the leading semiconductor manufacturers and provide optimized test coverage for the major wireless standards. From emerging millimeter wave devices to the traditional sub-6GHz, our test solutions are already leading the way.
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VXI Analog Instruments
Ai-762
Ai-762—the newest member of the Ai-760 Series in the Core Systems Instruments (CSi) family—is a standards-based integrated test and measurement tool that consolidates traditional instruments into a single-slot VXI package.
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Robotics
Teradyne Robotics brings the power of advanced automation to companies of all sizes, everywhere. Our solutions – which include collaborative robots, autonomous mobile robots and motion control software for robots – are safe, reliable and easy to deploy.Through our robotics companies – Universal Robots and Mobile Industrial Robots – we enable you to harness the combined power of machines and human talent to improve operational efficiency. The result is better quality, better products and better business.
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TestStation Rackmount
TSR
TestStation Rackmount (TSR) is designed for easy integration into high-volume automated manufacturing lines. This solution is a collection of specifically designed hardware modules that can be easily integrated into standard or custom automation handling equipment.
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Ultra-High Performance FLASH and DRAM Memories Test Solution
Magnum V
Teradyne’s Magnum V systems delivers high throughput and high parallel test efficiency for ultra-high performance FLASH and DRAM memories. Magnum V’s largest configuration delivers up to 20,480 digital channels at 1600Mbps per channel.
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High-Speed Digital Bus Test Instruments
Teradyne and AIT instruments test legacy and newer digital buses.The enormous variety of digital buses used in defense and aerospace applications requires comprehensive, yet efficient testing.Teradyne and AIT COTS instruments meet these challenging bus test requirements for legacy and standardized buses, as well as evolving digital buses that have faster speeds, larger data volumes, and increasingly complex protocols requiring real-time test and emulation.
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Automotive Production Board Test
Teradyne's TestStation platform enables manufacturers to easily react to rapidly changing product requirements. From volume, mix and test complexity - there is a TestStation configuration to meet your production requirements at the highest fault coverage and yield rate. configurable from a range of a few test points for basic shorts detection up to more than 15,000 test points for more complex PCBAs.
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Wireless Testing
Thorough testing of wireless technologies is essential, but it can’t result in production slowdowns or increased costs. Teradyne’s industry-leading wireless testers deliver high-throughput and get the newest technologies from the lab to high-volume manufacturing, quickly and cost-effectively.
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High-Speed Memory Test Solution
UltraFLEX-M
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Test System Optimized for High Volume Production Testing of Integrated Circuits
ETS-364 / ETS-600
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture. The test system offers separate floating resources for each site, improving site isolation and measurement accuracy coupled with digital instrumentation enabling the most efficient, high-volume testing available. The system supports up to 240 analog pin channels, and offers 133 MVPS digital vector rate with up to 128 digital pin channels. Eagle's scalability includes the ability to double the capacity of an ETS-364, providing more than 480 analog pin channels and up to 256 digital I/O pin channels with the ETS-600.
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Program Development for Multisite Test
IG-XL
Teradyne’s award winning IG-XL software transforms test program development for the FLEX, UltraFLEX and J750 family of testers. Its powerful, yet easy-to-use, graphical environment lets engineers rapidly develop fully functional test programs, cutting program development and debugging time. Designed to address multisite complexity, IG-XL can convert single site test programs to multisite automatically, speeding time to market and reducing cost of test. With IG-XL, test engineers focus on actual testing, not writing code for the tester.
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Smart Factory Solutions
Smart4Metrics Factory 4.0
Teradyne’s Smart4Metrics Factory4.0 solution closely integrates the TestStation in-circuit tester operating conditions, status and health data with existing data collection systems in the factory. By providing a single interface to convey both production data and production tester data, correlation of production results with other equipment or environmental conditions is easily integrated.
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Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.